2PIC for
High Density Deployment
Revolutionizing AI Cooling with 2PIC
Extreme Performance. Maximum Efficiency. Sustainable by Design.
Product
The Challenge
Thermal Limits of AI & HPC
Generative AI and High-Performance Computing (HPC) are driving unprecedented power density, pushing traditional cooling solutions beyond their limits. Localized hotspots and unstable thermal conditions have become critical barriers to performance and reliability.
The Solution
Two-Phase Immersion Cooling (2PIC)
Arivor introduces 2PIC, a next-generation cooling technology that delivers superior thermal stability compared to Direct Liquid Cooling (DLC):
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Full hardware immersion eliminates hotspots entirely
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Ensures a uniform and stable thermal environment
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Designed for extreme compute workloads
Equipped with the AIS100 AI Control System for real-time optimization:
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Intelligent feedback control mechanism
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Instant cooling response to thermal changes
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Maintains long-term stability under full load
Smart Thermal Control
AIS100 AI Control System
Unmatched Density
Redefining Server Form Factors
Feature | Traditional Air Cooling / DLC | Arivor 2PIC |
|---|---|---|
Hotspots | Present | Eliminated |
Cooling Method | Airflow-based | Full Immersion |
Chassis Size | ≥ 5U | 2U |
Power per GPU | 350W | 350W |
GPU Configuration | 10x PCIe GPUs | 10x PCIe GPUs |
Powered by SynState™ 6201 Immersion-Ready Server
Enables 10 high-power GPUs + dual CPUs in a compact 2U form factor
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Significantly reduces cooling power consumption
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Improves Power Usage Effectiveness (PUE)
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Ideal for AI and hyperscale deployments
Energy Efficiency
Optimized for Next-Gen Data Centers
Sustainability by Design
Built for ESG Compliance
Arivor 2PIC aligns with environmental goals:
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PFOA/PFOS-free coolants
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Ultra-low Global Warming Potential (GWP)
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Supports corporate ESG initiatives
Vapor Recovery Innovation
SynState™ Vapor Recycle System
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Achieves up to 99% VOC recovery rate
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Prevents coolant vapor leakage
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Reduces long-term operational costs
